甲磺酸亚锡

甲磺酸亚锡是一种化合物，化学式为Sn(CH₃SO₃)₂。它可由甲磺酸和氯化亚锡在110~120 °C回流反应制得，^[1]或通过锡粉与甲磺酸在140 °C反应得到。^[3]它可用于制备Cu₆Sn₅、Cu₂ZnSnS₄等含锡材料。^[4]^[5]

参考文献[编辑]

^ ^1.0 ^1.1 ^1.2 崔志明, 刘安昌. 甲基磺酸铅(II)、甲基磺酸锡(II)的制备. 电镀与精饰, 2001. 23 (4): 26-27.
^ 周彩荣, 李秋红, 王海峰, 李丹, 蒋登高. 甲基磺酸亚锡的热分析研究. 高校化学工程学报, 2006, 20 (4): 669-672.
^ 何柱生. 高纯度甲基磺酸亚锡生产新工艺. 化工进展. 2002, 21 (8): 589-591.
^ Zhangjian Zhao, Jing Shang, Anmin Hu, Ming Li. The effects of Sn solder grain size on the morphology and evolution of Cu6Sn5 in the aging process. Materials Letters. 2016-12, 185: 92–95 [2021-12-10]. doi:10.1016/j.matlet.2016.08.115. （原始内容存档于2018-06-24）（英语）.
^ Dingwang Huang, Kang Wang, Le Yu, Thi Hiep Nguyen, Shigeru Ikeda, Feng Jiang. Over 1% Efficient Unbiased Stable Solar Water Splitting Based on a Sprayed Cu 2 ZnSnS 4 Photocathode Protected by a HfO 2 Photocorrosion-Resistant Film. ACS Energy Letters. 2018-08-10, 3 (8): 1875–1881 [2021-12-10]. ISSN 2380-8195. doi:10.1021/acsenergylett.8b01005 （英语）.

N Martyak, R Seefeldt. On the oxidation of Tin (II) in methanesulfonate solutions and the role of trace chloride. Plating and surface finishing, 2004.
Martyak, Nicholas M.; Seefeldt, Robert. On the oxidation of tin(II) in methanesulfonate solutions and the role of sulfate. Galvanotechnik, 2005. 96 (3): 594-601. ISSN 0016-4232.