Apple Silicon

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Apple Silicon[1][2]是對蘋果公司使用ARM架構設計的单片系统(SoC)和封裝體系(SiP)处理器之总称。它廣泛運用在iPhoneiPadApple Watch以及HomePodApple TV等蘋果公司产品當中。

苹果公司不具有生产芯片的业务,所有Apple芯片均由其他芯片代工企业,如三星台积电进行制造。第一款苹果公司自行设计的芯片是应用在iPhone 4上的Apple A4。苹果的后续新产品线,包括AirPodsApple WatchHomePod,从一开始均使用Apple芯片。在2020年6月的苹果全球开发者大会上,苹果公司首席执行官Tim Cook正式宣布,Mac电脑系列将在两年内从Intel公司的CPU迁移至自行设计的Apple芯片。[3]

考虑到不同类型设备的应用场景,苹果公司设计的芯片也分为不同系列。通常每款芯片以大写字母搭配数字的方式命名,其中字母表示所属系列,数字代表第几代。部分产品还会带上字母后缀,表示在该架构上的加强款。

A系列[编辑]

A系列芯片使用于iPhoneiPadiPod touchApple TV产品上。基于ARM架构,包括了CPUGPU缓存等器件。自2016年发布的iPad Pro(第一代)开始,所有A系列芯片均由台积电代工。

A4
2010年3月-2013年9月
A5
2011年3月-2016年9月
A5X
2012年3月–2012年10月
A6
2012年9月-2015年9月
A6X
2012年10月-2013年10月
2014年3月-2014年10月
A7
2013年9月-2017年3月
A8
2014年9月至今
A8X
2014年10月-2017年3月
A9
2015年9月-2018年9月
A9X
2015年11月-2017年6月
A10 Fusion
2016年9月至今
A10X Fusion
2017年6月至今
A11 Bionic
2017年9月-2020年4月
A12 Bionic
2018年9月至今
A12X Bionic
2018年10月-2020年3月
A13 Bionic
2019年9月至今
A12Z Bionic
2020年3月至今
A14 Bionic
2020年9月至今

S系列 [编辑]

S系列芯片用于Apple WatchHomePod Mini产品线中。

H系列[编辑]

H系列用于第二代及之后的AirPods系列,以及部分Beats系列。

T系列[编辑]

T系列芯片用于Mac产品线的部分产品。

W系列[编辑]

W系列芯片的主要功能和Wi-Fi以及蓝牙连接相关。

U系列[编辑]

作为超宽频芯片,U系列中首款芯片U1首次出现于2019年发布的iPhone 11系列。

M系列[编辑]

M系列芯片首次亮相于2020年11月的线上发布会,其中发布了首款芯片M1,用于三款新Mac产品[4],作为Mac向苹果芯片迁移计划的一部分。预计M系列芯片的后续产品,将会继续搭载于使用Apple Silicon的Mac产品上。

苹果芯片列表[编辑]

A 系列[编辑]

名称 型号 图片 半导体工艺 裸晶尺寸 晶体管数目 CPU ISA CPU CPU缓存 GPU FLOPS FP32/FP16 AI 加速器 内存 推出 Utilizing devices Initial OS Terminal OS
APL0098 S5L8900.jpg 90 nm引用错误:<ref>标签的name属性有太多的键值 72 mm2[5] ARMv6 412 MHz single-core ARM11 L1i: 16 KB
L1d: 16 KB
PowerVR MBX Lite @ 103 MHz 不適用 16-bit Single-channel 133 MHz LPDDR (533 MB/s)[6] June 2007 iPhone OS 1.0 iOS 4.2.1
APL0278 S5L8720.jpg 65 nm[5] 36 mm2[5] ARMv6 412–533 MHz single-core ARM11 L1i: 16 KB
L1d: 16 KB
PowerVR MBX Lite @ 133 MHz 32-bit Single-channel 133 MHz LPDDR (1066 MB/s) September 2008 iPhone OS 2.1.1
APL0298 Apple SoC S5L8920.jpg 65 nm[7] 71.8 mm2[8] ARMv7 600 MHz single-core Cortex-A8 L1i: 32 KB
L1d: 32 KB
L2: 256 KB
PowerVR SGX535 32-bit Single-channel 200 MHz LPDDR (1.6 GB/s) June 2009 iPhone OS 3.0 iOS 6.1.6
APL2298 S5L8922.jpg 45 nm[5] 41.6 mm2[5] ARMv7 600–800 MHz single-core Cortex-A8 L1i: 32 KB
L1d: 32 KB
L2: 256 KB
PowerVR SGX535 @ 200 MHz 32-bit Single-channel 200 MHz LPDDR (1.6 GB/s) September 2009 iPhone OS 3.1.1 iOS 5.1.1
A4 APL0398 Apple A4 Chip.jpg 45 nm[5][8] 53.3 mm2[5][8] ARMv7 0.8–1.0 GHz single-core Cortex-A8 L1i: 32 KB
L1d: 32 KB
L2: 512 KB
PowerVR SGX535[9] 32-bit Dual-channel 200 MHz LPDDR (3.2 GB/s) March 2010 iPhone OS 3.2 iOS 5.1.1
iOS 6.1.6
iOS 7.1.2
A5 APL0498 Apple A5 Chip.jpg 45 nm[10] 122.2 mm2[10] ARMv7 0.8–1.0 GHz dual-core Cortex-A9 L1i: 32 KB
L1d: 32 KB
L2: 1 MB
PowerVR SGX543MP2 (dual-core) @ 200 MHz (12.8 GFLOPS)[11] 32-bit Dual-channel 400 MHz LPDDR2-800 (6.4 GB/s) March 2011 iOS 4.3 iOS 9.3.5
iOS 9.3.6
APL2498 Apple-A5-APL2498.jpg 32 nm HK MG[12] 69.6 mm2[12] 0.8–1.0 GHz dual-core Cortex-A9 (one core locked in Apple TV) L1i: 32 KB
L1d: 32 KB
L2: 1 MB
PowerVR SGX543MP2 (dual-core) @ 200 MHz (12.8 GFLOPS)[11] 32-bit Dual-channel 400 MHz LPDDR2-800 (6.4 GB/s) March 2012 iOS 5.1
APL7498 Apple-A5-APL7498.jpg 32 nm HKMG[13] 37.8 mm2[13] Single-core Cortex-A9 L1i: 32 KB
L1d: 32 KB
L2: 1 MB
PowerVR SGX543MP2 (dual-core) @ 200 MHz (12.8 GFLOPS)[11] 32-bit Dual-channel 400 MHz LPDDR2-800 (6.4 GB/s) March 2013
A5X APL5498 Apple A5X Chip.jpg 45 nm[14] 165 mm2[14] ARMv7 1.0 GHz dual-core Cortex-A9 L1i: 32 KB
L1d: 32 KB
L2: 1 MB
PowerVR SGX543MP4 (quad-core) @ 200 MHz (25 GFLOPS)[11] 32-bit Quad-channel 400 MHz LPDDR2-800[15] (12.8 GB/s) March 2012 iOS 5.1 iOS 9.3.5
iOS 9.3.6
A6 APL0598 Apple A6 Chip.jpg 32 nm HKMG[16][17] 96.71 mm2[16][17] ARMv7s[18] 1.3 GHz[19] dual-core Swift[20] L1i: 32 KB
L1d: 32 KB
L2: 1 MB[21]
PowerVR SGX543MP3 (triple-core) @ 266 MHz (25.5 GFLOPS)[22] 32-bit Dual-channel 533 MHz LPDDR2-1066[23] (8.528 GB/s) September 2012 iOS 6.0 iOS 10.3.3
iOS 10.3.4
A6X APL5598 Apple A6X chip.jpg 32 nm HKMG[24] 123 mm2[24] ARMv7s[18] 1.4 GHz dual-core Swift[25] L1i: 32 KB
L1d: 32 KB
L2: 1 MB
PowerVR SGX554MP4 (quad-core) @ 266 MHz (68.1 GFLOPS)[25][26] 32-bit Quad-channel 533 MHz LPDDR2-1066 (17.1 GB/s)[27] October 2012
A7 APL0698 Apple A7 chip.jpg 28 nm HKMG[28] 102 mm2[29] ≈1 billion ARMv8.0-A[30] 1.3 GHz[31] dual-core Cyclone[30] L1i: 64 KB
L1d: 64 KB
L2: 1 MB
L3: 4 MB[30] (Inclusive)[32]
PowerVR G6430 (quad-core) @ 450 MHz (115.2 GFLOPS)[33][26] 64-bit Single-channel 800 MHz LPDDR3-1600[34] (12.8 GB/s)[35] September 2013 iOS 7.0 iOS 12.5.1
APL5698 Apple A7 S5L9865 chip.jpg 28 nm HKMG[36] 102 mm2[29][36] ≈1 billion 1.4 GHz[37] dual-core Cyclone[30] L1i: 64 KB
L1d: 64 KB
L2: 1 MB
L3: 4 MB[37] (Inclusive)[32]
PowerVR G6430 (quad-core) @ 450 MHz (115.2 GFLOPS)[26] 64-bit Single-channel 800 MHz LPDDR3-1600[34] (12.8 GB/s)[35] October 2013 iOS 7.0.3
A8 APL1011 Apple A8 system-on-a-chip.jpg 20 nm (TSMC)[34] 89 mm2[38] ~2 billion ARMv8.0-A[39] 1.1–1.5 GHz dual-core Typhoon[39][40] L1i: 64 KB
L1d: 64 KB
L2: 1 MB
L3: 4 MB[39] (Inclusive)[32]
Custom PowerVR GXA6450 (quad-core)[41][42][43] @ ~533 MHz (136.5 GFLOPS) 64-bit Single-channel 800 MHz LPDDR3-1600[34] (12.8 GB/s)[35] September 2014 iOS 8.0

tvOS 9.0

iOS 12.5.1


Current

A8X APL1012 Apple A8X system-on-a-chip.jpg 20 nm (TSMC)[44][45] 128 mm2[44] ~3 billion ARMv8.0-A 1.5 GHz triple-core Typhoon[44][40] L1i: 64 KB
L1d: 64 KB
L2: 2 MB
L3: 4 MB[44] (Inclusive)[32]
Custom PowerVR GXA6850 (octa-core)[41][44][45] @ ~450 MHz (230.4 GFLOPS) 64-bit Dual-channel 800 MHz LPDDR3-1600[44] (25.6 GB/s)[35] October 2014 iOS 8.1 Current
A9 APL0898 Apple A9 APL0898.jpg 14 nm FinFET (Samsung)[46] 96 mm2[47] >2 billion ARMv8.0-A 1.85 GHz dual-core Twister[48][49] L1i: 64 KB
L1d: 64 KB
L2: 3 MB
L3: 4 MB (Victim)[32][50]
Custom PowerVR GT7600 (hexa-core)[41][51] @ 650 MHz (249.6 GFLOPS) 64-bit Single-channel 1600 MHz LPDDR4-3200[49][50] (25.6 GB/s)[49] September 2015 iOS 9.0 Current
APL1022 Apple A9 APL1022.jpg 16 nm FinFET (TSMC)[47] 104.5 mm2[47]
A9X APL1021 Apple A9X.jpg 16 nm FinFET (TSMC)[52] 143.9 mm2[52][53] >3 billion ARMv8.0-A 2.16–2.26 GHz dual-core Twister[54][55] L1i: 64 KB
L1d: 64 KB
L2: 3 MB
L3: none[32][52]
Custom PowerVR GTA7850 (12-core)[41][52] @ 650 MHz (499.2 GFLOPS) 64-bit Dual-channel 1600 MHz LPDDR4-3200 (51.2 GB/s) November 2015 iOS 9.1 Current
A10 Fusion APL1W24 Apple A10 Fusion APL1W24.jpg 16 nm FinFET (TSMC)[56] 125 mm2[56] 3.3 billion ARMv8.1-A 2.34 GHz quad-core (2× Hurricane + 2× Zephyr)[57] L1i: 64 KB
L1d: 64 KB
L2: 3 MB
L3: 4 MB
Custom PowerVR GT7600 Plus (hexa-core)[41][58][59] @ 900 MHz (345.6 GFLOPS[60]) 64-bit Single-channel 1600 MHz LPDDR4 (25.6 GB/s) September 2016 iOS 10.0 Current
A10X Fusion APL1071[61] Apple A10X Fusion.jpg 10 nm FinFET (TSMC)[53] 96.4 mm2[53] >4 billion ARMv8.1-A 2.36 GHz hexa-core (3× Hurricane + 3× Zephyr)[62] L1i: 64 KB
L1d: 64 KB
L2: 8 MB
L3: none[62]
Custom PowerVR GT7600 Plus (12-core)[41][63] ~@ 1000 MHz (~768 GFLOPS) 64-bit Dual-channel 1600 MHz LPDDR4[62][61] (51.2 GB/s) June 2017 iOS 10.3.2

tvOS 11.0

Current
A11 Bionic APL1W72 Apple A11.jpg 10 nm FinFET (TSMC) 87.66 mm2[64] 4.3 billion ARMv8.2-A[65] 2.39 GHz hexa-core (2× Monsoon + 4× Mistral) L1i: 64 KB
L1d: 64 KB
L2: 8 MB
L3: none[66]
Custom design (triple-core) @ 1066 MHz (~408 GFLOPS) Neural Engine (dual-core) 600 BOPS 64-bit Single-channel 2133 MHz LPDDR4X[67][68] (34.1 GB/s) September 2017 iOS 11.0 Current
A12 Bionic APL1W81 Apple A12.jpg 7 nm FinFET (TSMC N7) 83.27 mm2[69] 6.9 billion ARMv8.3-A[70] 2.49 GHz hexa-core (2× Vortex + 4× Tempest)[71] L1i: 128 KB
L1d: 128 KB
L2: 8 MB
L3: none[71]
Custom design (quad-core) ~@ 1125 MHz (~576 GFLOPS) Neural Engine (octa-core) 5 TOPS 64-bit Single-channel 2133 MHz LPDDR4X[72][73] (34.1 GB/s) September 2018 iOS 12.0 Current
A12X Bionic APL1083 Apple A12X.jpg 7 nm FinFET (TSMC N7) ≈135 mm2[74] 10 billion ARMv8.3-A[70] 2.49 GHz octa-core (4× Vortex + 4× Tempest) L1i: 128 KB
L1d: 128 KB
L2: 8 MB
L3: none[75]
Custom design (hepta-core) ~@ 1340 MHz (~1200 GFLOPS) Neural Engine (octa-core) 5 TOPS 64-bit Dual-channel 2133 MHz LPDDR4X (68.2 GB/s) October 2018 iOS 12.1 Current
A12Z Bionic Apple A12Z.jpg Custom design (octa-core) @ 1266 MHz (~1296 GFLOPS) March 2020 iPadOS 13.4 Current
June 2020 macOS 11 "Big Sur" (Beta) Current
A13 Bionic APL1W85 Apple A13 Bionic.jpg 7 nm FinFET (TSMC N7P) 98.48 mm2[76] 8.5 billion ARMv8.4-A[77] 2.65 GHz hexa-core (2× Lightning + 4× Thunder) L1i: 128 KB
L1d: 128 KB
L2: 8 MB
L3: none[78]
Custom design (quad-core) ~@ 1575 MHz (~806 GFLOPS) Neural Engine (octa-core) + AMX blocks (dual-core) 5.5 TOPS 64-bit Single-channel 2133 MHz LPDDR4X (34.1 GB/s)[79] September 2019 iOS 13.0 Current
A14 Bionic APL1W01 Apple A14.jpg 5 nm FinFET (TSMC N5) 88 mm2[80] 11.8 billion ARMv8.6-A 2.99 GHz hexa-core (2× Firestorm + 4× Icestorm)

L1i: 192 KB
L1d: 128 KB
L2: 8 MB
L3: none

Custom design (quad-core) Neural Engine (16-core) 11 TOPS 64-bit Single-channel 2133 MHz LPDDR4X (34.1 GB/s) September 2020 iOS 14.0 Current
名称 型号 Image 半导体工艺 裸晶尺寸 晶体管数目 CPU ISA CPU CPU缓存 GPU FLOPS FP32/FP16 AI 加速器 Memory technology Introduced Utilizing devices Initial OS Terminal OS

S 系列[编辑]

名称 型号 图片 半导体工艺 裸晶尺寸 CPU ISA CPU CPU缓存 GPU 内存 基带 Introduced Utilizing devices Initial OS Terminal OS
S1 APL0778[81] Apple S1 module.png 28 nm HK MG[82][83] 32 mm2[82] ARMv7k[83][84] 520 MHz single-core Cortex-A7[83] L1d: 32 KB[83]
L2: 256 KB[83]
PowerVR Series 5[83][85] LPDDR3[86] April 2015 watchOS 1.0 watchOS 4.3.2
S1P TBC Apple S1P module.png TBC TBC ARMv7k[87][88][89] 520 MHz dual-core Cortex-A7 without GPS[87] TBC PowerVR Series 6 'Rogue'[87] LPDDR3 September 2016 watchOS 3.0 watchOS 6.3
S2 TBC Apple S2 module.png TBC TBC ARMv7k[87][88][89] 520 MHz dual-core Cortex-A7 with GPS[87] TBC LPDDR3
S3 TBC Apple S3 module.png TBC TBC ARMv7k[90] Dual-core TBC TBC LPDDR4 Qualcomm MDM9635M (Snapdragon X7 LTE) September 2017 watchOS 4.0 Current
S4 TBC Apple S4 module.png TBC TBC ARMv8-A ILP32[91][92] Dual-core Tempest TBC Apple G11M[92] TBC TBC September 2018 watchOS 5.0 Current
S5 TBC Apple S5 module.png TBC TBC ARMv8-A ILP32 Dual-core Tempest TBC Apple G11M TBC TBC September 2019 watchOS 6.0 Current
S6 TBC Apple S6 module.png TBC TBC TBC Dual-core Thunder TBC TBC TBC TBC September 2020 watchOS 7.0 Current

T 系列[编辑]

名称 型号 图片 半导体工艺 裸晶尺寸 CPU ISA CPU CPU缓存 GPU 内存 Introduced Utilizing devices
T1 APL1023[93] Apple T1 Processor ARMv7 TBD October 2016
T2 APL1027[94] Apple T2 Processor ARMv8-A TBD LPDDR4 December 2017

W 系列[编辑]

名称 型号 图片 半导体工艺 裸晶尺寸 CPU ISA CPU CPU缓存 内存 Bluetooth Introduced Utilizing devices
W1 343S00130[95]
343S00131[95]
Apple W1 chip TBC 14.3 mm2[95] TBC TBC TBC TBC 4.2 September 2016
  • AirPods (1st gen.)
  • Beats Solo3
  • Beats Studio3
  • Powerbeats3
  • BeatsX
  • Beats Flex
W2 338S00348[96] Apple W2 chip TBC TBC TBC TBC TBC TBC 4.2 September 2017
W3 338S00464[97] Apple W3 chip TBC TBC TBC TBC TBC TBC 5.0 September 2018

H 系列[编辑]

名称 型号 图片 Bluetooth Introduced Utilizing devices
H1 343S00289 (AirPods gen.2)[98]
343S00290 (AirPods gen.2)[99]
343S00404 (AirPods Max)[100]
H1 SiP (AirPods Pro)[101]
Apple H1 chip Apple H1 chip Apple H1 chip
Apple H1 SiP Apple H! SiP
5.0 March 2019

U 系列[编辑]

名称 型号 图片 半导体工艺 Introduced Utilizing devices
U1 TMKA75[103] Apple U1 chip 16 nm FinFET (TSMC 16FF) September 2019

M 系列[编辑]

名称 型号 图片 半导体工艺 裸晶尺寸 晶体管数目 CPU ISA CPU CPU cache GPU AI accelerator Memory technology Introduced Utilizing devices Initial OS Terminal OS
M1 APL1102 Apple M1 processor 5 nm (TSMC) 119 mm2[104] 16 billion ARMv8.6-A 3.2 GHz 8-core
(4× Firestorm + 4× Icestorm)

Performance Cores:
L1i: 192 kB
L1d: 128 kB
L2: 12 MB shared

Efficiency Cores:
L1i: 128 kB
L1d: 64 kB
L2: 4 MB shared

7- or 8-core
(up to 2.6 TFLOPs)
16-core

(11 TOPS)

64-bit Dual Channel

4266 MHz LPDDR4X

(68.2 GB/s)[105]

November 2020 macOS Big Sur Current

其他[编辑]

型号 图片 Introduced CPU ISA Specs 用途 Utilizing devices 操作系统
339S0196 339S0196 microcontroller March 2011 Arm 256 MB RAM Lightning to HDMI conversion Apple Digital AV Adapter XNU


参考文献[编辑]

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